GESP TECH -TRUSTWORTHY ONE-STOP PCB SERVICES PCB FABRICATION CAPABILITITES
Introduction
The design engineer assigns each circuit board a unique function. In order to produce a PCB that is adequate for achieving PCB fabrication capabilities. it is necessary to use a complex manufacturing procedure. Consequently, the production of a PCB is a multistep, complex procedure. This review focuses on the most vital procedures involved in the fabrication of a multilayer PCB. When purchasing PCBs from GESP Technology, you are investing in quality that will pay for itself over time. This is ensured by product specifications and quality control. that are significantly more strict than those of other providers. thereby ensuring that the product fulfills its claims.
GESP PCB FABRICATION CAPABILITIES
All the time, our PCB fabrication capabilities of consistent superior quality at a reasonable price. GESP manufactures PCBs in accordance with all international quality standards. We are always satisfying the requirements of customers as well as the fabrication demands. whether we given a single PCB for prototyping or bulk orders. At GESP, we have a special focus on multi-layered PCBs. HDI PCBs.GESP PCB fabrication capabilities to ensure our customers receive the best quality products. If you want PCB fabrication services, please quote on our website or call us immediately.
PCB FABRICATION PROCESS
PCB Development
First, we will examine the term PCB development. Essentially, this entails the following procedures:
Design \Layout \Testing
PCB Manufacturing
PCB manufacturing is another term that is often used. This is actually a two-step process that includes:
PCB Fabrication\ Assembly
Testing PCBs
It makes sure that any mistakes are found and that any changes that need to be made can be made so that problems don’t come up later.
Assembling PCBs
This step consists of mounting the components on the bare board. This accomplished using through-hole , surface-mount technology
THE PROCESS OF PCB FABRICATION CAPABILITITES
Develop/Etching/Strip Process
Before work starts on a multi-layer printed circuit board. the areas that will become the traces, pads, and metal ground put down with laser direct imaging (LDI).On top of a copper laminate, a dry film has existed.Laser direct imaging lets light shine on parts of the board that match the pattern on the PCB.Any parts of the board that are not exposed will develop, leaving the film as an etch barrier.The rest of the film is an etch barrier that will remove off the copper to make the copper circuitry.The layers checked for flaws by an automated optical inspection before lamination. Fixed any mistakes, like possible shorts or opens.
Oxide and Layers
After etching, the inner layers of a PCB are treated with oxide to strengthen the bond. Then, heat and a hydraulic press to glue together layers of prepreg and copper foil. Prepreg is a material made of fiberglass with an epoxy resin that melts when heated and pressed. This glues the layers together to make a “PCB sandwich.”
Drilling
In order for signals to travel from one layer of a multilayer PCB to the next. holes drilled or lasered into them to create vias that connect the layers. Drilling performed on two or three panels at a time, depending on the type of through employed. Through electroless copper deposition. these holes plated with copper to aid in the transmission of electrical signals.
Dry Film and Electroless Copper Deposition
Chemical and mechanical techniques remove resin and debris after drilling holes. After removal, a thin copper coating applied to all exposed panels . to create a metallic base for electroplating. Dry film put to the copper panel’s outer layers . and laser direct imaged to create a conductive pattern. similar to the develop/etch/strip method.
Electroplating, Stripping, and Etching
The panel put into a copper plating bath with sulfuric acid and copper sulfate. The conductive pattern and drill holes are now visible. As more electricity flows through it. copper deposited on the conductive surface of the board until it is about 1 mil thick. The board is then removed and placed into a tin bath that acts as an etching barrier.
As the plating completed, the dry film is removed and the bare copper not covered by tin etched away. leaving only the traces, pads, and other patterns on the board. The remaining tin is then chemically stripped. leaving only the copper in the precise area.
Solder Mask, Silkscreen, and Surface Finish
A solder mask is a thin layer of polymer that shields the copper traces . that printed onto the board from oxidation. It also prevents solder bridges – when accidental joins form between two wires. reducing the functionality of a printed circuit board.
At this point, producers choose a solder mask color. usually green for its high contrast and trace visibility. which aids fault inspection during PCB prototyping. Darker solder mask colors absorb heat, making them unsuitable for high-temperature applications.
Once the solder mask deposited component reference designators. and extra board marks silkscreened onto the PCB. Oven-baking the circuit board cures the solder mask and silkscreened ink.
Assembly Preparation, Inspection, and Testing
After completion of the PCB fabrication process. the final boards subjected to a series of inspections. and testing to confirm their functionality prior to assembly or shipment. Any PCBs that fail the test are discarded.
THE PROCESS OF PCB FABRICATION CAPABILITITES
| No | Feature | Capabilities | |
| 1 | Layer Count | 1-20Layers | |
| 2 | Material | ALUMINUM ,COPPER CORE,CEM3,PI, PET, PEN, FR-4 | |
| 3 | Final Thickness | 0.2-3.2mm | |
| 4 | Surface Treatment | HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon Ink, Hard Gold(Flash Gold) | |
| 5 | Max / Min Board Size | 5mmx5mm≤Set≤1500x500mm | |
| 6 | Min Trace Width | 3/3mil | |
| Hoz – 10oz | |||
| Min hole: 8mil | |||
| 7 | Min Hole Size&Tolerance | Tolerance: PTH±3mil, NPTH±2mil | |
| 0.8mm×1mm | |||
| 8 | Copper Thickness | HOZ-10 OZ | |
| 9 | Quality Standards | IPC Class 2/ISO 9001: 2008/ISO/TS16949: 2009/UL 94v0 | |
| 10 | Other Tech | Blind Vias/Carbon Ink/Peelable Mask/Solder Sample | |
| 11 | Ink color | Green, Blue, Black, Red, Yellow, White and customized | |
GESP PCB FABRICATION EXPERCTS
With decades of experience in electronics manufacturing. GESP has high standard PCB fabrication capabilities. to best meet the unique project needs of our customers.Our team always work close with our clients. We can manage the entire procurement process and work to exact specifications.
We provide full supply chain control. only purchasing from franchised distributors or directly from component manufacturers. This ensures that we get the best opportunities and the best price points. that all suppliers are trustworthy and reputable. and that the procurement process is entirely traceable.