GESP TECH -TRUSTWORTHY ONE-STOP PCB SERVICES EXPLORE OUR ADVANCED FLEX PCB CAPABILITIES
FOR DYNAMIC APPLICATIONS

Introduction

As a leading manufacturer of flexible printed circuit boards, we are able to suit your specific needs with high-quality flex PCB capabilities. Utilize the limitless flexibility in packing geometry provided by flexible PCB!

With an ever-increasing need for flexible circuit boards, GESP is able to meet any difficulty, from design, manufacture, and prototyping to final production, at an affordable cost! Flexible circuits also known as flex circuits, flexible PCBs, flex print. It is presently one of the most essential interconnection technologies. used in the production of many of today’s most modern electronic devices.

GESP FLEX PCB CAPABILITIES

Feature
Capability
Layer Count
1-6Layers
Material
PI, PET, PEN, FR-4
Final Thickness
0.002″ – 0.1″ (0.05-2.5mm)
Surface Treatment
Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin
Max / Min Board Size
Min: 0.2″x0.3″  Max: 20.5″x13″
Min Trace Width
Min Clearance Inner
0.5oz: 4/4mil
1oz: 5/5mil
2oz: 5/7mil
Min Trace Width
Min Clearance Outer
1/3oz-0.5oz: 4/4mil
1oz: 5/5mil
2oz: 5/7mil
Min Hole Ring Inner
0.5oz: 4mil
1oz: 5mil
2oz: 7mil
Copper Thickness
1/3oz – 2oz
Max / Min Insulation Thickness
2mil/0.5mil (50um/12.7um)
Min Hole Size&Tolerance
Min hole: 8mil
Tolerance: PTH±3mil, NPTH±2mil
Min Slot
24mil x 35mil (0.6×0.9mm)
Silkscreen Line Width
5mil
Gold Plating
Nickel: 100u” – 200u”
Gold: 1u”-4u”
Immersion Nickel / Gold
Nickel: 100u” – 200u”
Gold: 1u”-5u”
Immersion Silver
Silver: 6u” – 12u”
OSP
Film: 8u” – 20u”
Test Voltage
Testing Fixture: 50-300V
Profile Tolerance of Punch
Accurate mould: ±2mil
Ordinary mould: ±4mil
Knife mould: ±8mil
Hand-Cut: ±15mil

RELATED RECOMMENDED RIGID-FLEX PCB

flexPCB

Flexible substrates make flexible circuit boards. Flex circuits made from polyimide and copper layers. Flexible PCBs bend without breaking. If the bend creases the copper, it will crack. Flexible circuits are not on thin “semi-flexible” FR4 boards. Because FR4 is brittle, a thin (10-mil) board will flex but break.
as flex and rigid-flex circuit board technologies progress. It is vital to understand technical elements while building flexible PCBs. Advanced flex and rigid-flex capabilities for high-tech items as below.

RIGID-FLEX PCB CAPABILITITES

Feature
Capability
Layer Count
2-8Layers
Material
PI, PET, PEN, FR-4
Final Thickness
0.0024″ – 0.16″ (0.06-4.0mm)
Surface Treatment
Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin
Max / Min Board Size
Min: 0.2″x0.3″  Max: 20.5″x13″
Min Trace Width
Min Clearance Inner
0.5oz: 4/4mil
1oz: 5/5mil
2oz: 5/7mil
Min Trace Width
Min Clearance Outer
1/3oz-0.5oz: 4/4mil
1oz: 5/5mil
2oz: 5/7mil
Min Hole Ring Inner
0.5oz: 4mil
1oz: 5mil
2oz: 7mil
Copper Thickness
1/3oz – 2oz
Max / Min Insulation Thickness
2mil/0.5mil (50um/12.7um)
Min Hole Size&Tolerance
Min hole: 8mil
Tolerance: PTH±3mil, NPTH±2mil
Min Slot
24mil x 35mil (0.6×0.9mm)
Silkscreen Line Width
5mil
Gold Plating
Nickel: 100u” – 200u”
Gold: 1u”-4u”
Immersion Nickel / Gold
Nickel: 100u” – 200u”
Gold: 1u”-5u”
Immersion Silver
Silver: 6u” – 12u”
OSP
Film: 8u” – 20u”
Test Voltage
Testing Fixture: 50-300V
Profile Tolerance of Punch
Accurate mould: ±2mil
Ordinary mould: ±4mil
Knife mould: ±8mil
Hand-Cut: ±15mil

WHAT ARE THE DIFFERENCES BETWEEN FLEX AND RIGID BOARDS?

Substances:

Rigid boards are usually composed of FR4. whereas flexible circuits made of polyimide. Polyimide used in the construction of stiff boards in some circumstances. but it is not as widespread.

Coverlay:

Flex PCBs have either a flexible mask or a coverlay. whereas rigid boards normally only have a solder mask. When using a coverlay, the apertures routed or laser cut. The coverlay is then adhered to the flex with an adhesive (usually 1 or 2 mils thick).

Stiffeners:

FR4 or polyimide stiffeners, are commonly used on flexible PCBs. to stiffen particular non-flexing zones. Stiffeners laminated to the flex or glued with PSA (pressure sensitive adhesive). Stiffeners are not required for rigid boards.

Permittivity:

Rigid board materials have a wide variety of relative permittivity . whereas flexible polyimide material is typically 3.4.

TRUST GESP FLEX PCB CAPABILITIES

GESP FLEXIBLE PCB MANUFACTURER
The main problem with using flex PCB in a consumer product is that they are more expensive. In an automated high-volume manufacturing facility. it costs less to make and install rigid circuit boards.In conclusion, GESP Technology makes printed circuit boards. and flexible circuit boards for companies that make products. Talk to one of our sales reps about it to find out. if flexible or rigid circuit boards are better for your product prototype design.

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