GESP Technology also an electronics manufacturing (EMS) services provider. We specialize in the assembly of high-tech systems and devices. that are supplied to OEM customers worldwide in medical technology. telecommunications, consumer electronics, industrial, energy, lighting, automotive, aerospace, IoT, etc. sectors. Our extensive services from co-design and co-engineering to prototyping. electronics manufacturing, and assembly, box building. system integration and supply chain management to NPI have helped global OEMs to increase their ROI.


To meet OEM customers’ demands for excellent electronic product performance. GESP Technology has put together a professional design team and engineering team. that specializes in helping customers achieve an optimal balance between cost. and performance to the highest To achieve production efficiency.
We offer customers shortcuts to the lowest manufacturing costs. by making changes to their design files without reducing expected functionality. To guarantee an unimpeded manufacturing process in later phases. we carry out a DFM / DFA test in front of the automatic production line. In addition, our Valor DFM / DFA review system enables minimizing the time. to review OEM products as the time to market is the shortest. Time is money for OEM customers and we are fully aware of it.



GESP Technology provides a quick turn prototyping service based on OEMs’ customizable requirements. Manual or automatic soldering can be performed as part of the customer’s prototyping services. if the priority level of the products and the efficiency elements of the OEM require it. We were able to quickly turn a concept into genuine items. with client ideas thoroughly articulated and published.


GESP technology manufacture adheres to ISO9001: 2008 and IPC norms and requirements. All the way through the electronic manufacturing process. GESP technology utilizes QCS to achieve optimal performance of all innovative manufacturing technologies. with minimal faults and maximum efficiency. Our electronic manufacturing services primarily cover PCB fabrication. electronics assembly, system integration and testing, box assembly, and so on.



Beginning with the creation of PCBs at the company’s inception. GESP Technology has established a solid foundation for its electronics manufacturing business. We have extensive production expertise in FR4 PCB, Flex/Flex-rigid PCB. Aluminum PCB, HDI PCB, High-frequency PCB, High-TG PCB. Thick Copper PCB, and several other Advanced PCB. All PCBs are compliant with the more stringent criteria of particular applications . functional implementations, and harsh environments.
In addition to standard standard circuit boards and advanced circuit boards. GESP Technology can produce highly mixed circuit boards. such as flexible circuit boards laminated with FR4. for applications with significantly greater requirements. Our capabilities for producing printed circuit boards include:
  • Blind / buried vias or micro vias
  • Countersink/countersink perforated). Half-cut / Castellated Hole
  • Goldfinger
  • Edge coating
  • RoHS compatibility


GESP Technology can provide a one-stop service for automatic electronic assembly. which includes all from printing solder pastes through component assembly. reflow soldering, and test inspection. To fulfill the needs of OEMs at various levels, we offer prototype assembly. high-mix assembly in small quantities, and assembly solutions in medium and large volumes.
Our plant has high-speed chip assembly devices from Samsung, a GKG printer. a lead-free reflow oven, high-resolution AOI and AXI. and 3D SPI to better meet the logistical requirements. and fulfillment of original equipment manufacturers. Furthermore, groups of skilled engineers and personnel along the production line supervise . and monitor the completion of each manufacturing process to quickly check the quality.


Even if there are many manufacturing steps available. GESP always monitors the performance of the finished products. and incorporates all processes into organic systems. Our engineers undertake technical discussions regarding heat management. structural analysis, and IC programming to capture linear monitoring . and optimization to achieve optimal system integration.
Testing and System Integration
The performance of electrical products must be confirmed via tests and inspections. Our experts prepare clients’ design files for the DFT throughout the design process. so that bespoke function tests can proceed without difficulty in subsequent stages.
We provide test techniques to guarantee the highest quality of our electronic products. Visual inspections, automatic optical inspections, and automatic X-ray inspections. These are the most often performed inspections for assemblies along the assembly process. Well-trained production staff visually inspects products for externally evident flaws. including assembly and solder paste printing quality.
Quality Control
Because quality is an electronics manufacturer’s lifeblood. At each phase of the manufacturing process, quality control is the key . The completion of each step subject to stringent quality control. which is undertaken throughout the process. When flaws are discovered, immediate changes or fixes. Advanced inspection techniques, such as x-ray inspection. These are necessary for quality control following processing. to find concealed flaws before packaging and distribution.


Our specialized design team concentrates on delivering a complex and visible housing model. based on the application environment of the product and the precise dimensions. and weight requirements of the final product. Box building is also dependent on the selection of materials. and GESP Technology creates all types of box materials for plastic. stainless steel, mild steel, and other metal products.
GESP Technology offers advanced plastic housings that are compliant with the shape. dimension, and application environment requirements of all OEM electronic device kinds. GESP Technology uses punching for electronic manufacturing systems . to obtain a high-quality injection molding process. depending on the design files of the OEMs and unique market requirements.


As a full-service provider for electronics manufacturing. GESP Technology offers expert supply chain management. as it is directly tied to quality assurance and efficient production. We are experts in procuring components from approved component manufacturers and distributors. Before being added to the production line. each and every component must pass standardized tests.
The advantage of the component storage service for long-term partners . who do not need electronic components for a one-time assembly. We store customer components in a professional component cabinet . with carefully controlled temperature and humidity. ensuring that the highest quality maintained during the subsequent assembly.


NPI is the most effective way to realize creative ideas and implement them quickly. Among all the elements that will ensure your first success at NPI. the first is a reliable contract manufacturer. When faced with customer requirements and wanting to reap benefits. we know exactly where to start and will respond quickly to what co-design. prototyping, testing and inspection, carton construction. and end-to-end marketing Instantly made products boost OEM ROI.

Client's Love PCB Manufacturer in China TALK ABOUT YOUR PROJECTS NOW!