Services for Electronics Manufacturing PRINTED CIRCUIT BOARD BGA
Introduction
TYPES OF PCB BGAS
BGA stands for Ball Grid Array, which is a type of surface mount package used in electronic circuits. There are several types of BGAs, including:
Plastic ball grid array (PBGA):
This is the most common type of BGA, and it features a plastic body with an array of solder balls on the bottom.
Ceramic ball grid array (CBGA):
This type of BGA has a ceramic body instead of a plastic one, which makes it more durable and able to handle higher temperatures. It is often used in high-performance applications.
Tape ball grid array (TBGA):
This type of BGA is similar to the PBGA, but the solder balls are attached to a tape rather than directly to the package.
Flip chip ball grid array (FCBGA):
In this type of BGA, the integrated circuit is flipped upside down and mounted directly onto the solder balls. This design allows for shorter interconnects and better performance.
Micro ball grid array (μBGA):
This is a smaller version of the BGA that is used in applications where space is limited, such as mobile devices.
Package-on-package (PoP) ball grid array:
This type of BGA involves stacking multiple BGAs on top of one another, which allows for more components to be packed into a smaller space. Each type of BGA has its own unique features and benefits, which make them suitable for different applications.
HOW THE PCB BGA WORKS
BGA (Ball Grid Array) assembly is a type of surface mount technology (SMT) used in electronic manufacturing. Here is a general overview of how BGA assembly works:
Design:
The first step is to design the PCB (Printed Circuit Board) layout, including the placement of BGA components.
Stencil Printing:
A stencil is used to apply solder paste to the PCB. The stencil has openings that correspond to the locations where the BGA components will be placed. The solder paste is applied to these openings using a squeegee.
Placement:
The BGA components are placed on the PCB using pick-and-place machines. These machines can place components at a high speed and with high accuracy.
Reflow:
The PCB is heated in a reflow oven, causing the solder paste to melt and reflow. This fuses the BGA components to the PCB.
Inspection:
After reflow, the PCB is inspected to ensure that the BGA components are properly soldered and aligned. Automated optical inspection (AOI) machines are commonly used for this step.
X-ray Inspection:
A specialized X-ray machine is used to inspect the BGA components’ internal connections for any potential defects.
Cleaning:
The PCB is cleaned to remove any remaining flux or residue.
Testing:
The final step is to test the PCB to ensure that it functions as intended.
BGA assembly is a complex process that requires specialized equipment and skilled technicians. However, it is widely used in electronic manufacturing due to its high density, low profile, and superior electrical performance compared to other types of package assemblies.
WHAT IS THE DIFFERENCE BETWEEN BGA AND PCB?
A PCB, or printed circuit board, is a board made of non-conductive material (such as fiberglass or plastic) that serves as a foundation for electronic components. The board contains a pattern of copper traces that connect various components to one another and to power sources. PCBs can be single-sided or multi-layered, depending on the complexity of the circuit design.
A BGA, or ball grid array, is a type of surface-mount packaging used for integrated circuits. It consists of a small chip mounted on a substrate with an array of tiny solder balls underneath. These solder balls allow the chip to be mounted directly onto a PCB without the need for wires or leads. BGAs are used for high-density electronic components where space is limited, and they provide a more reliable and robust connection compared to other packaging types.