PCB Assembly

To meet the needs of customers of small-batch prototype prototypes to quickly generate PCBA and test, and help customers shorten the production cycle, GESP Technology has launched a one-stop assembly service for Prototype PCB.

Our state-of-the-art assembly equipment enables us to meet all your PCBA needs under one roof in an inexpensive way, our Printed Circuits Boards Assembly Capability includes but not limited to what is listed below, as we are updating our equipment constantly to keep us on the cutting edge.

SMT Assembly Capabilities

SMT Assembly -- Components are mounted by placing them directly onto the PCB's surface. We have the capabilities to assemble SMT prototype PCBs in small production runs with manual and automated SMT production processes, including single- or double-sided component insertions. Our production facilities can assemble the following SMT types:

Ball Grid Array (BGA)

Ultra-Fine Ball Grid Array (U-BGA)

Quad Flat Pack No-Lead (QFN)

Quad Flat Package (QFP)

Small Outline Integrated Circuit (SOIC)

Plastic Leaded Chip Carrier (PLCC)

Package-On-Package (PoP)

Small Chip Packages (pitch of 0.2 mm)

If your PCB Assembly demands are beyond these capabilities, please contact us at marketing@GESPCB.com, we will respond if we can do or not within 24 hours.