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marketing@gespcb.com15+Years Devoted to PCB Solutions & Manufacturing
To meet the needs of customers of small-batch prototype prototypes to quickly generate PCBA and test, and help customers shorten the production cycle, GESP Technology has launched a one-stop assembly service for Prototype PCB.
Our state-of-the-art assembly equipment enables us to meet all your PCBA needs under one roof in an inexpensive way, our Printed Circuits Boards Assembly Capability includes but not limited to what is listed below, as we are updating our equipment constantly to keep us on the cutting edge.
Specifications |
Capabilities |
Types Of Assembly |
THD (Thru-Hole Device) THD (Thru-Hole Device) SMT (Surface-Mount Technology) SMT & THD mixed 2 sided SMT and THD assembly Full Turnkey Partial Turnkey/Combo Consignment/kitted |
Order Quantity |
1 to 100000 boards |
Components |
Passive Component: we can accept components as small as 01005, 0201,0402. Fine pitch to 8 Mils BGA, uBGA, QFN,POP and Leadless chips Connectors and terminals |
Components Package |
Reels Continuous Tape Cut tape Tube and tray Loose parts and bulk |
Board Dimensions |
Smallest size: 0.2" x 0.2" Largest size: 15" x 20" |
Board Shape |
Rectangular Round Slots and Cut outs Complex and Irregular |
Board Type |
Rigid boards Rigid-Flex boards |
Assembly Process |
Leaded process Lead-Free (RoHS) |
Design File Format |
Gerber RS-274X BOM (Bill of Materials) (.xls, .csv, . xlsx) Centroid(Pick-N-Place/XY file) |
Sales and Support |
Emails Phone calls |
Electrical Testing |
X-ray Inspection AOI (Automated Optical Inspection) Functional testing |
Oven Profile |
Standard Custom |
Turnaround Time |
1-5 days for only PCB assembly 10-16 days for turnkey PCB assembly |
SMT Assembly -- Components are mounted by placing them directly onto the PCB's surface. We have the capabilities to assemble SMT prototype PCBs in small production runs with manual and automated SMT production processes, including single- or double-sided component insertions. Our production facilities can assemble the following SMT types:
Ball Grid Array (BGA)
Ultra-Fine Ball Grid Array (U-BGA)
Quad Flat Pack No-Lead (QFN)
Quad Flat Package (QFP)
Small Outline Integrated Circuit (SOIC)
Plastic Leaded Chip Carrier (PLCC)
Package-On-Package (PoP)
Small Chip Packages (pitch of 0.2 mm)
If your PCB Assembly demands are beyond these capabilities, please contact us at marketing@GESPCB.com, we will respond if we can do or not within 24 hours.
It is easy to enquire with GESP Tech. Call +86-0411-8853-5976 or email marketing@gespcb.com, the sales engineer best-suited to the nature of enquiry will be in 24 hours.