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Multilayer PCB

Multilayer PCB

Because of multilayer PCB inherent electrical qualities. multilayer PCB offer great capacity and fast speed in a smaller footprint. Apperently, Higher assembly density. It reduced the Connectors necessary for numerous distinct PCBs. hence simplifying manufacturing and decreasing weight.

multilayer printed circuit board

What Is a Multilayer PCB?

A multilayer PCB  at least with three layers of conductive copper foil. just like double-sided multilayer PCBs laminated and glued with heat-resistant insulating layers. Two layers placed on the surface sides of the PCB to connect it to the outside world. All electrical connections established via vias layers. such as plated through holes, blinds, and buried vias. so varying PCBs size and degrees of complexity by the implementation of this technology.

Why Are Multilayer PCBs So Widely Used?

The applications mention only a small part of the multilayer PCBs used in the industry. But why are they so popular?Multilayer PCBs are now required as a result of the increased density. which has led to a high concentration of interconnecting lines.  In the configuration of the printed circuit. unanticipated design difficulties including noise, stray capacitance, and crosstalk development. Thus, the design of the PCB must focus on lowering signal line length and avoiding parallel paths.

Due to the restricted number of crossings that may be performed in a single or even double panel. these requirements are hard to reach. In the event of a large number of interconnections and crossover needs. so the board needs more than two layers to reach a reasonable level of performance. resulting in the emergence of multilayer boards. as we konw Multilayer PCBs consist of numerous alignment layers. with a thin dielectric layer between each pair of layers. At least, three conductive layers are present on multilayer circuit boards. These two are on the exterior surface and one is created within the insulating board. Typically, the electrical connection between them is established by plating through holes in the board’s cross-section.

The Benefits of Multilayer PCB

1. The density of the multilayer PCB assembly is high and compact.

2.Multilayer PCB wiring convenience, shortened wiring length, and component connections. favorable to enhancing signal transmission speed. 3.For high-frequency circuits, the addition of a ground layer causes the signal line to form a constant low impedance with the ground layer. so reducing circuit impedance and enhancing the shielding effect. 4.  For the high need for heat dissipation function of electronic devices. multilayer PCBs need to design with a metal core heat dissipation layer. to meet the requirements of shielding, heat dissipation, and other unique characteristics. 5 . Multilayer PCB is superior to single and double PCB performance.

but the more the number of layers, the higher the production cost. the longer the processing time, and the more complex the quality testing. 6. Multilayer PCBs consist of four or six layers. the difference between 4-layer and 6-layer PCB is the presence of a ground layer and power layer. between two more internal signal layers on the six-layer board, which is also thicker. Due to its design versatility, economic superiority, electrical performance stability, and dependability. multilayer PCB is currently used in the production of electronic devices.

Tips for Disadvantages of Multilayer PCB

Multilayer board

1. More expensive

Due to the complexity of the design and manufacturing process. multilayer circuit boards are more expensive than single-layer circuit boards.

2. Extended lead time

So that each layer turned into a separate circuit board. the production process for multilayer boards is complex and lengthy.

3. Maintenance can be challenging

It is difficult to repair a multilayer PCB if it develops a defect Certain internal. Sometime, it cannot be visable the internal layers from the exterior. It means more challenges to determine . what caused the component or physical board’s damage. The reason for the component or board damage. Additionally, That need consider the number of integrated components on the board.

What is the Difference Between Single-Layer and Multi-layer PCB?

PCB Standard type in single-sided and double-sided orientation. known as single-sided and double-sided. but in high-end electronic devices, due to the limits of product space design factors. besides to surface wiringand stacked the inside with many layers of lines. After fabricated each layer, optical equipment positions and presses them together.

Allowing many layers of circuits to superimposed on a single board. Often referred to as a multilayer circuit board. A multilayer circuit board is any circuit board with more than two layers but fewer than four. PCB with many layers types as rigid PCB, flex and rigid multilayer PCB, and flex PCB.

How do you differentiate between multilayer and single-layer PCB?

1.Hold up to the light,if the inner core is opaque and black, it is a multilayer board. if it is transparent, it is a single double-sided board. and if it is a single-sided board, there is no copper inside the hole. The front and back sides of the copper guide through the hole are double-sided.

2. The number of line layers is the most significant distinction between 2 and 3. Single-layer PCB only one layer of lines. no metallization in the holes, and no plating procedure. Double-layer PCB consists of two layers of lines. with metalized and non-metalized holes, and a plating procedure. 3.PCBs divided into single-sided PCBs, double-sided PCBs, and multilayer PCBs. with the latter referring to PCBs with three or more layers. The multilayer PCB production based on a single sided panel . plus the inner layer lamination production process.

Applications for Multilayer board

The printing industry

The printing industry pcb

From a conventional standpoint, industrial electronic equipment should concentrate on preventing corrosion. also Tri-proof paint is frequently used as a coating layer on the surface of PCBs. It is a particular coating layer.

That  besides to the remove properties, is shock-resistant and insulated. Multi-layer PCB’s stable performance, and strong protection, suited for the boarding process. can meet the printing industry’s mechanical performance requirements for ongoing high-speed operation.

The electronic equipment sector

application multilayer pcb

Electronic packaging technology is basically a way to make a semiconductor chip harder and more brittle through a specific method of plastic sealing.

This helps the chip better meet its needs for protection. heat dissipation, and wiring to meet the chip’s needs for power distribution. system integration, and other performance requirements. so that it can better play an important role in so many applications.

The packaging for these electrical parts needs to offer a pretty high level of protection. For the above goals, multilayer PCB PCB is better than single-layer PCB PCB. This is because different electronic components have different material and function needs.

The field of intelligent house design

Smart Home multi-layer

The use of PCB in the field of home design is a result of the emergence of smart home thinking. people expect a more intelligent effect on the home space environment. To achieve this aim. a variety of walls, floors, and other locations utilized to guide the smart device PCB. Multilayer PCB with its improved reaction facilitates the development of smart home spaces. Multilayer PCB relies on its improvement of typical PCB performance transformation. deriving little new performance from the former.

Creating a more sophisticated and detailed product structure. That is the current consensus of the Chinese machinery industry. To reach this aim as soon as possible. it required to continue to steer the renewal of technology and product replacement.

The manufacturing process of Multilayer PCB

1. Material choice

Accordingly with the development of high-performance. multi-functional electronic components. as well as the high-frequency, high-speed development of signal transmission. the requirements of electronic circuit materials, dielectric constant, and dielectric loss are low . along with low CTE, low water absorption, and better high-performance copper clad materials . It need to meet the processing and reliability requirements of multilayer boards.

2. Design for a laminated laminated structure

In the design of the laminated structure. that need to considered the heat resistance of the material. the voltage resistance, the amount of adhesive filling. the thickness of the dielectric layer. these are the primary considerations. The following guidelines as follow: A. The manufacturer of the semi-cured sheet and the core board must be consistent. B. When the client requests a high TG sheet. fabricated both the core board and the semi-cured sheet from a material with a high TG. C.For interior substrates of 3OZ or more, use semi-cured, high-resin-content sheeting. D. If the client has no specific requirements. the interlayer media layer thickness tolerance control by +/-10 percent. For impedance boards, the media layer thickness tolerance control the IPC-4101 C/M level tolerance.

3. Layer alignment management

basically ,Inner layer core board size compensation accuracy and production size control. the need for a specific period in the production of historical data. and the graphic size of each layer of the high-level board for accurate compensation . to ensure that the core board of each layer up and down consistency.

4. Inner layer line method

A machine that uses laser direct imaging to improve the graphic resolution of high-level board making. To improve the ability to etch lines. the engineering design must take into account the line’s width and pad . and make sure that the inner layer line width, line distance. isolation ring size, independent line, and hole-to-line distance design compensation is reasonable. If not, the engineering design need to fix.

5. Pressing method

Presently, the interlayer positioning method before pressing together consists four slot positioning. Pin LAM , hot melt, rivet, and a combination of hot melt and rivet. as well as various product structures employing various positioning methods.

6. Drilling method

Due to the super-thickness of the plate and copper layer caused by the stacked layers. the drill bit worn and prone to breaking. thus, the number of holes, drop speed, and rotation speed must change downward.


consequently, It is of the most importance when searching for multilayer PCB. at the same time we need to get the manufacturer’s capabilities and standard tolerances for these complex boards. Additionally, must to use design for manufacturing (DFM) techniques to accommodate those standards. This wiil be a long way toward generating confidence . that the result will fulfill all the expectations about its functionality. reliability, and performance.

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