GESP TECH -TRUSTWORTHY ONE-STOP PCB SERVICES HDI PCB - HIGH DENSITY INTERCONNECT PCBs
Whats HDI PCB?
HDI circuit boards are PCBs that have a higher wiring density per unit area than regular PCBs. In general, HDI PCBs have the following features: microvias, blind and buried vias, built-up laminations. and high signal performance considerations. The evolution of PCB technology parallels the evolution of technology. which necessitates smaller and faster devices.. HDI boards are smaller and have fewer vias, pads, copper traces, and gaps. HDIs have denser wiring as a result. resulting in smaller weight, more compact, lower layer count PCBs. Instead of using multiple PCBs in a device, one HDI board can house the functionality of the prior boards.
TYPES OF HDI BOARD
Microvia HDI PCB
HDI PCB 2+n+2
3 Step HDI PCB
BENEFITS OF HDI PCB
HDI boards are ideal for applications where weight, space, dependability. and performance are of the utmost importance. The combination of blind vias, buried vias. and microvias reduces the space requirement of the circuit board.
Enhanced Signal Integrity
The HDI incorporates via-in-pad and blind via technologies to improve signal integrity. This allows components to be placed closer together, shortening the signal path. The HDI technology eliminates via stubs. which reduces signal reflections and improves signal quality. Consequently, it significantly improves signal integrity due to the shorter signal paths. Signal Integrity: The Effects of Via Stubs on Signal Attenuation and Data Transfer Rates
The stacked vias makes these circuit boards impervious to extreme environmental conditions.
For example, A standard 8-layer through-hole board can have its functionality . reduced to that of a 6-layer HDI board without compromising quality.
RAPID HDI PCB FABRICATION
If you require expedited high density interconnect PCB fabrication services, you need look no further than GESP. We have impressive quick turn PCB capabilities. including top engineers and cutting-edge technology. to meet your strict project deadlines and budget constraints. Depending on the complexity of your project. we can fabricate PCBs in as little as twenty-four hours.Our quick turn capabilities include:
- 1-5 day delivery
- Fully accredited military capabilities
- No subcontracting
- Instantaneous quoting, order entry, engineering, tooling, fabrication, testing, and shipping
RELIABLE HDI PCB MANUFACTURER-GESP TECH
GESP has the skills and experience to perform any task. including fabrication and manufacturing of high density interconnect . HDI PCBs used in a variety of industries, including the medical. military, aerospace sectors, and are gaining in popularity. Most commonly found in smartphones, tablets, and other electronic devices.
As a leading HDI PCB manufacturer, we continue to invest in the most advanced production . and testing equipment and technology at our factory in SHENZHEN. At GESP, we have the engineering expertise to handle complex projects. with pinpoint precision, on time and within budget.
HDI PCB MANUFACTURING PROCESS
High-density interconnect PCB processes are more advanced than conventional rigid PCB processing steps. but they use the same set of fabrication data as conventional rigid PCBs. HDI PCB manufacturing methods vary depending on the high density interconnect builds. with sequential lamination being the most common method. The simplest 1+N+1 HDI PCB fabrication is comparable to multilayer PCB fabrication.For instance:
A four-layer HDI PCB with a 1+2+1 structure as following manner:
- First, the inner two PCB layers are made and laminated.
- Mechanically drilling the two inner layers. Lasers drill the two outermost layers.
- Electroplate inner blind vias. Two outer layers laminate the inner layers.
A 2+4+2 HDI PCB is an example of a 2+N+2 stacked via HDI PCB.
- Four PCB layers are laminated. Create layers 2 and 7.
- Mechanically drilling inner layers. Lasers drill layers 2 and 7.
- Electroplate inner blind vias. Innermost layers 2 and 7 to bonded.
- Electroplating second and seventh-layer microvias.
- Manufacture first and eighth layers. HDI PCB manufacturer laser-drills microvia locations.
- PCB layers 1 and 8 are laminated.
It is easier to manufacture 2+N+2 staggered-via HDI PCBs than 2+N+2 stacked-via HDI PCBs . because microvias do not require high precision for locating and stacking.In addition to sequential laminating, technologies for creating stacked vias . and in-hole metallization are also utilized in HDI PCB fabrication. For higher HDI builds, it is also possible to directly laser-drill the stacked vias in the outer layers. However, direct laser drilling necessitates exceptionally high precision for the drilling depth. and the rate of scrap is high. Therefore, direct laser drilling is rarely used.
APPLICATIONS OF HDI PCB
HDI PCB Technology has demonstrated enormous potential in the healthcare and medical fields. For instance, tiny implanted devices such as pacemakers, portable X-Rays. and external devices such as hearing aids employ HDI PCB technology.
Due to their small size, HDI PCBs are utilized in the vast majority of consumer products. including smartphones, tablets, laptop computers, touch screen products, and home appliances.
Since HDI PCBs can withstand extreme environmental conditions. they can be utilized in the design of electronic components for missile systems. aircraft, and defense applications.
Due to the size of HDI PCBs, they are commonly used in wearable technologies. For instance, VR headsets, smartwatches, and smart clothing, amongst others.
FAQs FOR HDI PRINTED CIRCUIT BOARD
Why should I consider HDI?
At a certain level of circuit complexity. employing an architecture with blind and buried vias will result in a higher yield. and lower cost than a through-hole design.
How does HDI keep my cost down?
One of the challenges designers face is controlling costs. Our intention is to provide you with some insight to aid in your decision-making. When making PCB design decisions for HDI. manufacturability and cost are among the primary considerations. HDI boards, like standard PCB designs, have four primary concerns:
- Multiple layers and laminations
- Vias in HDI categories
- Optimal tracing and spacing
What is the costliest stackable class?
The cost increases as sequential laminations increase. Three sequential laminations are the most costly type of stacking. This includes microvias stacked on top of one another, which is required when breaking out of a 0.3 mm pitch BGA. Using a non-conductive hole through process is second in the stack-up class in terms of cost.
What exactly is a microvia?
To accommodate the high input/output (I/O) density of advanced packages. microvias used as interconnects between layers on HDI substrates and PCBs. The electronics industry strives to produce inexpensive, lightweight. and dependable products with enhanced functionality. On the PCB and package substrate levels. this translates to the use of high density interconnects.