High Density Interconnect (HDI) PCB Improves PCB Fabrication Quality
HDI PCB, or High-Density Interconnect technology. refers to the manufacturing process of creating printed circuit boards (PCBs). with a high density of components and connections.High density interconnect (HDI) PCB Improves PCB fabrication quality. High density interconnect board used to create PCBs that are smaller in size.That have a higher circuit density, and are more complex than traditional PCBs.
HDI allows for the creation of PCBs with multiple layers of conductive material. HDI PCB Improves PCB fabrication with vias connecting these layers. These vias are usually created using laser technology. allowing for precise and accurate placement of components and connections. HDI also allows for the use of smaller components and more complex designs. which can lead to increased functionality and improved performance.
Types of Vias in HDI PCB Improves PCB Fabrication Quality
Vias are tiny conductive holes that connect multiple layers on a HDI PCB. and allow signals to easily flow through them. Depending on the functionality of a PCB, four different types of vias drilled into an HDI PCB. As follow through hole vias, blind vias, buried vias, and microvias.
Through-Hole Vias –
A hole pierced through the PCB from top to bottom with a drill or laser. connecting all layers of a multi-layer PCB. Through-hole PCBs are simple to build and the most cost-effective type of via. Plated through (with copper pads) holes and non-plated through holes are the two types of through holes (without copper pads).
Blind Vias –
A type of via in which a hole pierced with a drill. or laser to connect the external and internal layers of a multi-layer high density interconnect PCB. Because the hole is only visible on one side of the PCB board, it referred to as a blind via. This type of via is difficult to build and expensive.
A buried via-
Connects two internal layers of a multi-layer HDI PCB. This via is always located within the PCB and is never visible from the outside. As a result, it known as buried via. The buried via is an electroplated hole that requires its own drill file. A buried via has an even number of layers, such as 2, 4, 6, and so on.
Microvias are the smallest vias or holes drilled with a laser that have a diameter of less than 150 microns. Microvias, which have a much smaller diameter than mechanically drilled vias. such as through-holes, are most commonly used in HDI PCBs to connect one layer of the PCB to its adjacent layer. They enable denser printed circuit boards with more complex designs. due to their size and ability to connect one layer to an adjacent layer.
Structure of HDI PCB Improves PCB Fabrication Quality
1+N+1 HDI PCB
The HDI PCB (1+N+1) structure is the simplest form of HDI PCB. where 1 represents the number of outer layers. N represents the number of microvia layers, and 1 represents the number of inner layers. Applications that require high-density routing and limited space use this structure.
Microvias connect the outer and inner layers of the 1+N+1 HDI PCB structure. Microvias are small holes that drilled into the PCB, which connects the layers of the PCB. The use of microvias allows for a higher density of connections and reduces the overall size of the PCB.
HDI PCB (2+N+2): Moderate Complex HDI
The HDI PCB (2+N+2) structure is a more complex form of HDI PCB. where 2 represents the number of outer layers. N represents the number of microvia layers, and 2 represents the number of inner layers. This structure used in high-component-density applications with limited PCB space.
In the 2+N+2 HDI PCB structure. the outer layers connected to the inner layers using blind vias. which are holes that connect an outer layer to an inner layer without penetrating the entire PCB. Buried vias connect PCB inner layers. Microvias are also used to connect the layers of the PCB. allowing for a higher density of connections and reducing the overall size of the PCB.
ELIC HDI PCBs
ELIC, or Every Layer Interconnection, is the most complex form of HDI PCB technology. As the name suggests, it involves interconnecting every layer of the PCB. which allows for the highest possible component density and the smallest possible form factor.
In ELIC HDI PCBs, each layer of the PCB connected to every other layer using microvias. buried vias, and blind vias. This allows for a much higher density of connections and components than other HDI PCB structures. The use of microvias and buried vias also helps reduce the overall size of the PCB. making it ideal for applications where space is limited.
Importance of Using HDI PCB Fabrication
HDI (High-Density Interconnect) PCB fabrication is an advanced technology. that allows for the creation of smaller and more complex circuit boards with high precision and reliability. Here are some of the reasons why using HDI PCB fabrication is important:
Increased functionality: HDI PCB fabrication allows for the placement of more components. and interconnections in a smaller space, which increases the functionality of the board. This is particularly important in devices such as smartphones, tablets.
Better signal integrity:
HDI PCB fabrication enables shorter and more direct connections between components. which reduces signal loss and interference, resulting in better signal integrity.
HDI PCBs have a lower risk of failure due to their increased precision and reduced size. They also have better resistance to environmental factors such as temperature, humidity. and vibration, making them more reliable.
Cost savings: HDI PCBs require fewer layers and components, which can reduce the cost of the board. Additionally, the smaller size of the board reduces the overall cost of the device.
Faster production time:
HDI PCBs produced quickly and efficiently using advanced manufacturing techniques. such as laser drilling and direct imaging, which reduces the production time and cost.
Overall, using HDI PCB fabrication is important for creating smaller, more complex. and reliable circuit boards that offer improved functionality and signal integrity. while also reducing cost and production time.
Applications of HDI (High-Density Interconnect) PCBs
HDI (High-Density Interconnect) PCBs have numerous applications in various industries, including:
Consumer Electronics: HDI PCBs are commonly used in consumer electronics. such as smartphones, tablets, and wearables. These devices require small and lightweight PCBs with high component density. and HDI technology is perfect for meeting those requirements.
Medical Devices: Medical devices such as implantable devices, pacemakers. and diagnostic equipment require high-density and reliable PCBs. HDI technology ensures that these devices are small, lightweight, and have enhanced reliability.
Automotive Industry: HDI PCBs are also used in the automotive industry for applications. such as advanced driver assistance systems (ADAS), infotainment systems, and engine management systems. The high-density interconnects on the PCBs help reduce the size of the components. making them ideal for use in the limited space available in vehicles.
Aerospace Industry: The aerospace industry also makes use of HDI PCBs in applications such as flight control systems. satellite communication systems, and avionics. These applications require high reliability, durability. and resistance to harsh environments, which HDI PCBs can provide.
Industrial Control Systems: HDI PCBs are commonly used in industrial control systems . such as factory automation, power generation, and robotics. These applications require high-density and reliable PCBs that can operate in harsh environments.
Overall, the applications of HDI PCBs are diverse and cover various industries. from consumer electronics to aerospace and medical devices. Their small size, high-density interconnects. in applications with limited space and high reliability.
Why Choose GESP HDI PCB Improves PCB Fabrication Quality ?
GESP summed up the experience try to reduce HDI costs for our clients. we believe that the hole copper thickness is one of the important factors affecting the reliability and life of the PCB. if too thin, the conductive hole after high temperature or high current applications. there is a possibility to pulled off, resulting in board failure. we focus on PCB manufacturing 17 years. and GESP HDI has its own complete system, the entire process is not outsourced. all quality acceptance standards as IPC2 level standards. such as hole copper thickness ≧ 20μm. GESP with the most advanced hole-filling line. as well as the most advanced VCP horizontal plating line, resin plug hole line. Ensure that all PCBs qualities. Contact Us Now!