GESP TECH -TRUSTWORTHY ONE-STOP PCB SERVICES FLEX PCB CAPABILITIES
Introduction
As a leading manufacturer of flexible printed circuit boards, we are able to suit your specific needs with high-quality flex PCB capabilities. Utilize the limitless flexibility in packing geometry provided by flexible PCB!
With an ever-increasing need for flexible circuit boards, GESP is able to meet any difficulty, from design, manufacture, and prototyping to final production, at an affordable cost! Flexible circuits also known as flex circuits, flexible PCBs, flex print. It is presently one of the most essential interconnection technologies. used in the production of many of today’s most modern electronic devices.
GESP FLEX PCB CAPABILITIES
Feature | Capability | |
Layer Count | 1-6Layers | |
Material | PI, PET, PEN, FR-4 | |
Final Thickness | 0.002″ – 0.1″ (0.05-2.5mm) | |
Surface Treatment | Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin | |
Max / Min Board Size | Min: 0.2″x0.3″ Max: 20.5″x13″ | |
Min Trace Width Min Clearance Inner | 0.5oz: 4/4mil 1oz: 5/5mil 2oz: 5/7mil | |
Min Trace Width Min Clearance Outer | 1/3oz-0.5oz: 4/4mil 1oz: 5/5mil 2oz: 5/7mil | |
Min Hole Ring Inner | 0.5oz: 4mil 1oz: 5mil 2oz: 7mil | |
Copper Thickness | 1/3oz – 2oz | |
Max / Min Insulation Thickness | 2mil/0.5mil (50um/12.7um) | |
Min Hole Size&Tolerance | Min hole: 8mil | |
Tolerance: PTH±3mil, NPTH±2mil | ||
Min Slot | 24mil x 35mil (0.6×0.9mm) | |
Silkscreen Line Width | 5mil | |
Gold Plating | Nickel: 100u” – 200u” | Gold: 1u”-4u” |
Immersion Nickel / Gold | Nickel: 100u” – 200u” | Gold: 1u”-5u” |
Immersion Silver | Silver: 6u” – 12u” | |
OSP | Film: 8u” – 20u” | |
Test Voltage | Testing Fixture: 50-300V | |
Profile Tolerance of Punch | Accurate mould: ±2mil | |
Ordinary mould: ±4mil | ||
Knife mould: ±8mil | ||
Hand-Cut: ±15mil | ||
RELATED RECOMMENDED RIGID-FLEX PCB
Flexible substrates make flexible circuit boards. Flex circuits made from polyimide and copper layers. Flexible PCBs bend without breaking. If the bend creases the copper, it will crack. Flexible circuits are not on thin “semi-flexible” FR4 boards. Because FR4 is brittle, a thin (10-mil) board will flex but break.
as flex and rigid-flex circuit board technologies progress. It is vital to understand technical elements while building flexible PCBs. Advanced flex and rigid-flex capabilities for high-tech items as below.
RIGID-FLEX PCB CAPABILITITES
Feature | Capability | |
Layer Count | 2-8Layers | |
Material | PI, PET, PEN, FR-4 | |
Final Thickness | 0.0024″ – 0.16″ (0.06-4.0mm) | |
Surface Treatment | Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin | |
Max / Min Board Size | Min: 0.2″x0.3″ Max: 20.5″x13″ | |
Min Trace Width Min Clearance Inner | 0.5oz: 4/4mil 1oz: 5/5mil 2oz: 5/7mil | |
Min Trace Width Min Clearance Outer | 1/3oz-0.5oz: 4/4mil 1oz: 5/5mil 2oz: 5/7mil | |
Min Hole Ring Inner | 0.5oz: 4mil 1oz: 5mil 2oz: 7mil | |
Copper Thickness | 1/3oz – 2oz | |
Max / Min Insulation Thickness | 2mil/0.5mil (50um/12.7um) | |
Min Hole Size&Tolerance | Min hole: 8mil | |
Tolerance: PTH±3mil, NPTH±2mil | ||
Min Slot | 24mil x 35mil (0.6×0.9mm) | |
Silkscreen Line Width | 5mil | |
Gold Plating | Nickel: 100u” – 200u” | Gold: 1u”-4u” |
Immersion Nickel / Gold | Nickel: 100u” – 200u” | Gold: 1u”-5u” |
Immersion Silver | Silver: 6u” – 12u” | |
OSP | Film: 8u” – 20u” | |
Test Voltage | Testing Fixture: 50-300V | |
Profile Tolerance of Punch | Accurate mould: ±2mil | |
Ordinary mould: ±4mil | ||
Knife mould: ±8mil | ||
Hand-Cut: ±15mil | ||
WHAT ARE THE DIFFERENCES BETWEEN FLEX AND RIGID BOARDS?
Substances:
Rigid boards are usually composed of FR4. whereas flexible circuits made of polyimide. Polyimide used in the construction of stiff boards in some circumstances. but it is not as widespread.
Coverlay：
Flex PCBs have either a flexible mask or a coverlay. whereas rigid boards normally only have a solder mask. When using a coverlay, the apertures routed or laser cut. The coverlay is then adhered to the flex with an adhesive (usually 1 or 2 mils thick).
Stiffeners：
FR4 or polyimide stiffeners, are commonly used on flexible PCBs. to stiffen particular non-flexing zones. Stiffeners laminated to the flex or glued with PSA (pressure sensitive adhesive). Stiffeners are not required for rigid boards.
Permittivity：
Rigid board materials have a wide variety of relative permittivity . whereas flexible polyimide material is typically 3.4.
TRUST GESP FLEX PCB CAPABILITIES
