Enhancing Performance with Thermal-Electric Separation Copper PCBs
Have you ever experienced the following issues? LED beads overheating, decreased brightness, and shorter lifetime? Have you ever considered using improved PCB materials to tackle these challenges? particularly in automotive LED beads or high-frequency PCBs? To tackle these heat dissipation issues. the first thing that comes to mind is an aluminum substrate. However, this is most typically employed in low-power LEDs. As a firm that has specialized in the fabrication of PCBs for over 20 years. we pleased to present you with the thermal-electric separation copper PCB. as a potential solution to the heat dissipation problem. We pleased to present you with the thermal-electric separation copper PCB.
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What is the Thermal-Electric Separation Copper PCB？
To introduce thermal-electric separation copper PCB. we must begin with the metal core PCB. Aluminum-based PCB, copper-based PCB, and iron-based PCB are the three basic metal core PCB materials. With the development of high-power electronic products and high-frequency PCB. heat dissipation and volume requirements are also increasing. which the ordinary aluminum substrate has been unable to meet. more and more high-power products use copper substrate. The number of items requiring copper substrate processing technologies is likewise growing. so what is the copper substrate, and what are the advantages of copper PCB ? today we start Advantages, we’re going to start talking to you today.
To achieve the best heat conduction effect of heat dissipation. The copper PCB to do the thermoelectric separation. refers to a copper substrate processing of a thermoelectric separation process. The circuit part of the substrate and the thermal layer part of the different line layers. the thermal layer part of the direct contact with the lamp bead heat dissipation part. This process is the heat generated by the electronic components. directly through the thermal conductivity of the area. greatly improving the effect of heat dissipation.
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Technical Steps for Thermal-electric Separation Copper PCB
Looking at the graph above, we can see that heat dissipation. needs to insulated by thermal conductivity materials (purple part of the chart). processing is more convenient. but the thermal conductivity coefficient is not so good. after the insulation of thermal conductivity materials. This is suitable for low-power LED lamps, enough to use.
Because aluminum PCB and conventional copper PCB cannot match the heat dissipation. needs of automotive LED lamp beads or high-frequency PCBs. thermal-electric separation copper PCB is widely used. In order to achieve the best heat dissipation (zero thermal resistance) effect. the line part of the copper substrate and the thermal layer part of the line in different layers. the thermal layer part of the direct contact with the beads of the thermal part (such as the right part of the picture above).
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The benefits of thermal-electric separation copper PCB
- The application of a thermal-electric separation copper PCB. contact with the lamp beads with negligible thermal resistance. and a significant reduction in lamp bead light degradation to increase lamp bead life.
- The use of a thermal-electric separation copper PCBwith a high density, the substrate’s own heat carrying capacity. superior thermal conductivity, and heat dissipation.
- The same power condition is smaller due to the high density copper substrate heat-carrying capability.
- Suited for matching single high-power lamp beads. particularly COB package, to improve the performance of lamps and lanterns.
- Surface treatment layer dependability can be varied according to different needs (OSP, tin spray, immersion gold, gold plating, immersion silver, silver plating, etc.).
- Various structures created to meet the various design requirements of the lights and lanterns. (copper bumps, copper concave blocks, thermal layer parallel to the line layer).
For small power 1W or so lamp beads, aluminum substrate can actually meet. and the application of copper plate, absolutely high-power, such as automotive lamps. do not move dozens of W, or hundreds, and the thermal conductivity of copper can reach 400W or so. and only the “thermo-electric separation of copper substrate”. in order to give play to the heat dissipation characteristics of copper. and the copper substrate is a good choice to high power electronics.
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Professional Tips For thermal-electric separation copper PCB
For the driving power of 13W LED lamp beads, the thermoelectric separation of copper PCB . and ordinary copper substrate corresponding to the chip junction temperature of 49.72 and 73.14 °C . respectively, corresponding to the module of the thermal resistance of 2.21 and 4.37 °C / W . which means that the thermoelectric separation of the copper substrate. compared to ordinary copper substrate in the man. This suggests that the thermoelectric separation copper substrate. It is more favorable in high-power LED thermal management than the standard copper substrate.
Thermoelectric separation of copper PCB realized by separating the thermal layer from the line layer. so that the heat generated by the components conducted directly through the heat dissipation area. the thermal conductivity efficiency has been significantly improved, thereby improving product life. The copper substrate core thermal conductivity composition of aluminum trioxide. and silicon powder composition and epoxy resin-filled polymer composition. thermal resistance is small, with excellent viscoelastic properties. resists thermal aging, and can withstand mechanical and thermal stress.
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One-stop PCB Services : Quick Turn PCB, Fast PCB Prototype，Low Volume Customized PCB
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