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GESP Technology

15+Years Devoted to PCB Solutions & Manufacturing

Electronics Manufacturing Services

Electronics Manufacturing Services

GESP Technology also an electronics manufacturing (EMS) services provider. We specialize in the assembly of high-tech systems and devices that are supplied to OEM customers worldwide in medical technology, telecommunications, consumer electronics, industrial, energy, lighting, automotive, aerospace, IoT, etc. sectors. Our extensive services from co-design and co-engineering to prototyping, electronics manufacturing, and assembly, box building, system integration and supply chain management to NPI have helped global OEMs to increase their ROI.

Co-Design and Co-Engineering

To meet OEM customers' demands for excellent electronic product performance, GESP Technology has put together a professional design team and engineering team that specializes in helping customers achieve an optimal balance between cost and performance to the highest To achieve production efficiency.

We offer customers shortcuts to the lowest manufacturing costs by making changes to their design files without reducing expected functionality. To guarantee an unimpeded manufacturing process in later phases, we carry out a DFM / DFA test in front of the automatic production line. In addition, our Valor DFM / DFA review system enables minimizing the time to review OEM products as the time to market is the shortest. Time is money for OEM customers and we are fully aware of it.

PCB Prototype

GESP Technology offers a quick turn prototyping service based on the flexible requirements of OEMs. Manual or automatic soldering can be carried out as part of the customer's prototyping services if this is desired by the priority level of the products and the efficiency aspects of the OEM. We managed to quickly convert a concept into real products, with the ideas of the customers being explained and published in detail.

PCB Manufacturing

The production in GESP technology complies with the regulations and standards of ISO9001: 2008 and IPC. Throughout the electronic manufacturing process, QCS (Quality Control System) is used in GESP technology to achieve optimal performance of all advanced manufacturing technologies with minimized errors and maximized efficiency. Our electronic manufacturing mainly includes PCB manufacturing, electronics assembly, system integration, and testing, box build, etc.

PCB Fabrication

Starting with the production of printed circuit boards at the beginning of the company foundation, GESP Technology has created a solid basis for the electronics manufacturing service. We have rich experience in manufacturing FR4 PCB,Flex /Flex-rigid PCB, Aluminum PCB,HDI PCB, High-frequency PCB, High-TG PCB, Thick Copper PCB, and many other Advanced PCB. All printed circuit boards are compatible with the higher requirements of special applications in terms of running speed, functional implementations or extreme environments.

In addition to pure standard circuit boards and advanced circuit boards, GESP Technology can also manufacture highly mixed circuit boards such as flexible circuit boards laminated with FR4 for much higher application requirements. Our production capacities for printed circuit boards include:

● 1.Blind / buried vias or micro vias

● 2.Over in pad

● 3.Countersink/countersink perforated). Half-cut / Castellated Hole

● 4.Goldfinger

● 5.edge coating

● 6.Kapton tape

● 7.RoHS compatibility

SMT Assembly

GESP Technology can implement a service for one-stop automatic electronic assembly, which ranges from printing solder pastes to the assembly of components, reflow soldering and test inspection. We offer prototype assembly, high-mix assembly in small quantities and assembly options in medium and large quantities to meet the requirements of OEMs at various levels.

To provide original equipment manufacturers with a punctual and reliable assembly service, our factory has high-speed chip assembly devices from Samsung, a GKG printer, a lead-free reflow oven, high-resolution AOI and AXI, and 3D SPI to better meet their logistical requirements and fulfillment. Besides, groups of professional engineers and employees along the production line observe and monitor the completion of each production phase to check the quality immediately.

Detailed assembly capabilities of GESP Technology are summarized into the following table

Quality Grade
Standard IPC Class 3
Assembly Type
SMT, PTH, Single/Double-Sided Assembly, POP and Press Fit
Solder Type
Wave Solder, Reflow Solder (lead-free)
Component Type
SMD 01005 or larger
BGA 0.4mm pitch
WLCSP 0.35mm pitch
PCB Size
Max: 500mm*450mm, Min: 30mm*30mm
(Panels for smaller sizes)
Other Techniques
Flying Probe Test, IC Programming, Function Test

System Integration and Testing

Despite the availability of so many manufacturing stages, GESP Technology always keeps an eye on the performance of the end products and integrates all phases into organic systems. To achieve optimal system integration, our engineers hold technical discussions about thermal management, structural analysis and IC programming to capture linear monitoring and optimization.

Tests and inspections are essential methods to confirm the performance of electronic products. During the design phase, our engineers optimize customers' design files for the Design for Test (DFT) goal so that custom function tests can run smoothly in later phases.

To ensure the top quality of our electronic products, we offer many different test methods. The most common inspections along the assembly line for assemblies include visual inspections, automatic optical inspections, and automatic X-ray inspections. The visual inspection is carried out by well-trained production personnel for externally visible defects such as solder paste printing quality and assembly.

Quality Control

Quality is the blood of an electronics manufacturer, so quality control was covered in all phases of the electronics manufacturing process. As an EMS solution provider for the aerospace industry and medical care, quality control cannot be neglected. For the quality control during the process, the completion of each phase must be subjected to strict controls. As soon as defects are identified, improvements or changes are made immediately. Advanced inspection equipment is required for quality control after the process, e.g. B. an X-ray inspection so that hidden defects can be uncovered before packaging and delivery. We are fully ISO9001: 2008, UL and RoHS certified. You can find our certificates here.

Box Build

The world's best-known OEMs place demands on both the external appearance and internal functions. The specialized design team at GESP Technology focuses on providing a complicated and clear housing model based on the application environment of the product and the specific requirements for the weight and size of the end product. Box construction is also associated with the choice of materials and GESP Technology prepares all types of box materials for products made of plastic, stainless steel, mild steel, and other metals.

All types of OEM electronics devices can expect GESP Technology to offer advanced plastic housings that are compatible with their shape, size, and application environment requirements. To obtain a high-quality injection molding process, GESP Technology implements punching for electronic manufacturing systems based on the design files of the OEMs and specific market requirements.

Supply Chain Management

As a full-service provider for electronics manufacturing, GESP Technology offers professional supply chain management because it is directly related to quality guarantee and smooth manufacturing. We specialize in the procurement of components from authorized component manufacturers or distributors. Every single component has to go through standard tests before it is included in the production line.

For long-term partners who do not use electronic components for a one-time assembly, the component storage service is an advantage. We store components for customers in the professional component cabinet with precisely set temperature and humidity, so that the highest quality is maintained during the next assembly.


New Product Introduction (NPI) is the most effective way to realize creative ideas and implement them quickly. Among all the elements that will ensure your first success at NPI, the first is a reliable contract manufacturer. When faced with customer requirements and wanting to reap benefits, we know exactly where to start and will respond quickly to what co-design, prototyping, testing and inspection, carton building an end-to-end marketing Products are instantly manufactured and greatly improve the OEM's ROI.

Reach GESP technology to discuss your electronic manufacturing needs

Do you need an electronic manufacturing service? GESP Technology will be happy to help you. You can provide our seller with project details and specific requirements. We will get back to you as soon as possible with a solution and an offer.

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