Ship to:/USD

GESP Technology

15+Years Devoted to PCB Solutions & Manufacturing

PCB Capability

PCB Capability

Our PCB supply chain has various procurement and production processes to meet manufacture requirement. As the processing of all following materials has been fully integrating into the standard production system, GESP Tech could offer them at competitive prices.

Whether it is standard PCB production or multi-layer Advanced PCB, GESP Tech can provide our clients with the most professional services. Free pre-natal document testing, the full set of electronic experimentation.

It is easy to enquire with GESP Tech. Call +86-0411-8853-5976 or email, the sales engineer best-suited to the nature of enquiry will be in 24 hours.

Features Capability
Standerd PCB Advanced PCB
Layer Count 1~12 1~32
Material FR-4 (Tg-135C, 145C, 170C), Halogen- free
Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003
Black FR-4
Arlon AR-350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Metal Core Materials
Aluminum Core
Board Thickness 0.020"-0.125" 0.005"-0.250"
Maximum Board Size 16" x 22" 10" x 16"
16" x 22"
12" x 21" 12" x 21"
22" x 28" 22" x 28"
Minimum Core Thickness 0.004" 0.002"
Copper Thickness 0.5 ~4 oz 0.25~6 oz
Minimum Trace Width / Spacing 0.004"/0.004" 0.003"/0.003"
Solder Mask Color Green, Blue, Black, Red, Yellow, White, Clear, and customized
Silkscreen Color White, Black, Yellow, Green, Red, Blue and customized
Minimum Hole Size 0.008" 0.004"
Finished Hole Size Tolerance +/-0.003" +/-0.002"
PCB Surface Finish HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG,HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon Ink, Hard Gold(Flash Gold), Soft Gold
Controlled Impedance Tolerance +/-10 % +/-5 %
Aspect Ratio 8/1 1/15
Quality Standards IPC Class 2
ISO 9001: 2008
ISO/TS16949: 2009
UL 94v0
Other Tech Blind Vias
Carbon Ink
Peelable Mask
Solder Sample
First Article © 2013-2020|GESP Technology. All rights reserved. Privacy Policy