Aluminum PCB is a kind of metal-based copper clad board with good heat dissipation function, mostly used in the production of LED lights. Here let us understand the aluminum PCB production process of the difficulty analysis and production specifications.

Aluminum PCB is often used in power devices, power density, so the copper foil is thicker. The etching process requires engineering design line width compensation if you use more than 3 ounces of copper foil.

Aluminum base surface in the PCB processing process in advance with a protective film to give protection; otherwise, some chemicals will leach aluminum base surface, resulting in damaged appearance.

The hardness of the milling cutter used in the production of glass fiber board is relatively small and the milling speed is fast; while the hardness of the milling cutter used in the production of aluminum PCB is large and the milling speed is at least two-thirds slower.

The production of glass fiber boards only needs to use the machine itself to dissipate heat, but the processing of aluminum PCBs must additionally add alcohol for the gong head heat.

Aluminum PCB manufacturers in the production of aluminum PCB process will have some difficulties. These difficulties are as follows.

1.The use of mechanical processing production of aluminum PCB, drilling holes in the hole edge does not allow burrs, otherwise it will affect the pressure resistance test. The aluminum PCB milling process is very difficult, and punching profiles require the use of advanced molds. After shape punching, the edges are required to be neat and burr-free without touching the solder resist layer on the board edge. Usually, using the manipulator die, hole punching from the line, shape punching from the aluminum surface, and punching shape after the board warpage should be less than 0.5%.

2.In the entire aluminum PCB production process, it is not allowed to rub the aluminum base surface by hand touch, or by a certain chemical that will produce surface discoloration or blackening, which is absolutely unacceptable. So the whole process does not touch, does not touch the aluminum base surface. This is one of the difficulties in the production of aluminum PCBs.

3.In the aluminum PCB over high-voltage test, communication power The board surface dirt, holes, and aluminum base edge burrs, line jagged or touching any point of the insulation layer will lead to high-voltage test fire, leakage, or breakdown. Results in voltage resistance test board delamination, blistering, and rejection are rejected.